Automatically controlled In-Line thin film PVD Deposition & Etching system. Modular and flexible multi-chamber integration design to accommodate various substrate sizes. Automatic process control, visualization of the recipe management and process, data management and process documentation.
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Features
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Technical Specifications
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Applications
Fully automatically controlled In-Line thin film PVD Deposition & Etching system for high throughput and reliable manufacturing processes.
Modular and flexible multi-chamber integration design to accommodate various substrate sizes, offering exceptional production flexibility.
Optimized system design for Linear/RF Plasma Etch, Planar/Rotary Magnetron Sputtering, Evaporation processes, with superior thin film deposition and etching uniformity.
Windows based user friendly GUI software with FAB integration of SEMI GEM/SECS interface, and industrial standard DeviceNet/PLC control system for ease of operation, maintenance, support and upgrades.
Fully automatic process control, visualization of the recipe management and process, data management and process documentation.
Substrate Metallization
Anti-Reflection & Transparent Conductive Oxides
Decorative Coatings
Adhesive Coatings
Tribological Coatings
EM Shielding Coatings
Plasma Clean of Substrate
Anneal of Substrate
Aerospace
Solar
Optical Electronics
Flat Panel Display
Semiconductor
MEMS
LED, OLED