Features
- Fully automatically controlled In-Line thin film PVD Deposition & Etching system for high throughput and reliable manufacturing processes.
- Modular and flexible multi-chamber integration design to accommodate various substrate sizes, offering exceptional production flexibility.
- Optimized system design for Linear/RF Plasma Etch, Planar/Rotary Magnetron Sputtering, Evaporation processes, with superior thin film deposition and etching uniformity.
- Windows based user friendly GUI software with FAB integration of SEMI GEM/SECS interface, and industrial standard DeviceNet/PLC control system for ease of operation, maintenance, support and upgrades.
- Fully automatic process control, visualization of the recipe management and process, data management and process documentation.
Technical Specifications
Applications
- Substrate Metallization
- Anti-Reflection & Transparent Conductive Oxides
- Decorative Coatings
- Adhesive Coatings
- Tribological Coatings
- EM Shielding Coatings
- Plasma Clean of Substrate
- Anneal of Substrate
- Aerospace
- Solar
- Optical Electronics
- Flat Panel Display
- Semiconductor
- MEMS
- LED, OLED
Gallery
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