Automatically controlled In-Line thin film PVD Deposition & Etching system. Modular and flexible multi-chamber integration design to accommodate various substrate sizes. Automatic process control, visualization of the recipe management and process, data management and process documentation.



Features


  • Fully automatically controlled In-Line thin film PVD Deposition & Etching system for high throughput and reliable manufacturing processes.
  • Modular and flexible multi-chamber integration design to accommodate various substrate sizes, offering exceptional production flexibility.
  • Optimized system design for Linear/RF Plasma Etch, Planar/Rotary Magnetron Sputtering, Evaporation processes, with superior thin film deposition and etching uniformity.
  • Windows based user friendly GUI software with FAB integration of SEMI GEM/SECS interface, and industrial standard DeviceNet/PLC control system for ease of operation, maintenance, support and upgrades.
  • Fully automatic process control, visualization of the recipe management and process, data management and process documentation.

Technical Specifications



Applications

  • Substrate Metallization
  • Anti-Reflection & Transparent Conductive Oxides
  • Decorative Coatings
  • Adhesive Coatings
  • Tribological Coatings
  • EM Shielding Coatings
  • Plasma Clean of Substrate
  • Anneal of Substrate
  • Aerospace
  • Solar
  • Optical Electronics
  • Flat Panel Display
  • Semiconductor
  • MEMS
  • LED, OLED

Gallery


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