
Features
- Industry proven wafer process equipment with long term reliability.
- Versatile process flexibility in micro/nano machining & patterning.
- Excellent film etching uniformity & process repeatability with AVP innovative ion source design.
- Wide range of applications and low cost of ownership.
- Environmentally friendly with only inert gases used in process.
Technical Specifications

Applications
- Micro-Machining/Patterning/Shaping
- Communications & Microwave Components
- Biomedical and Medical Components & Sensors
- Hard Drive, MRAM and other Magnetic Devices
- Optical Sensors
- MEMS Circuits and Sensors
- Plasma Clean and Texturing
- HCD & LCD Grid Performance
High Current Density Process![]() |
Low Current Density Process![]() |
Gallery
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