Industry proven wafer process equipment with long term reliability. Versatile process flexibility in micro/nano machining & patterning. Excellent film etching uniformity & process repeatability.



Features


  • Industry proven wafer process equipment with long term reliability.
  • Versatile process flexibility in micro/nano machining & patterning.
  • Excellent film etching uniformity & process repeatability with AVP innovative ion source design.
  • Wide range of applications and low cost of ownership.
  • Environmentally friendly with only inert gases used in process.

Technical Specifications



Applications


  • Micro-Machining/Patterning/Shaping
  • Communications & Microwave Components
  • Biomedical and Medical Components & Sensors
  • Hard Drive, MRAM and other Magnetic Devices
  • Optical Sensors
  • MEMS Circuits and Sensors
  • Plasma Clean and Texturing
  • HCD & LCD Grid Performance
    • High Current Density Process
         High Current Density Process     		Low Current Density Process
         Low Current Density Process

Gallery


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